0273729-A2 is referenced by 13 patents and cites 5 patents.

A solder resist ink composition is disclosed which contains a photo-curable resin (A2) obtained by causing an unsaturated monocarboxylic acid to react with a cresolnovolak- or phenolnovolak-type epoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, a photo-curable resin (B2) obtained by causing an unsaturated monocarboxylic acid to react with a bisphenol A novolak- or cycloaliphatic oxirane novolak-type epoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, at least one photo-polymerizable compound (C) selected from photo-polymerizable monomers, a photo-polymerization initiator, an organic solvent, and an inorganic filler. Also disclosed are two other solder resist ink compositions each having a different photo-curable component.

Title
Solder resist ink composition.
Application Number
EP19870311423 19871223
Publication Number
0273729 (A2)
Application Date
December 23, 1987
Publication Date
July 6, 1988
Inventor
Kohara Teiji C O Patent Divisi
Nakaizumi Yuji C O Patent Divi
Takeda Kazuhiro C O Patent Div
Wada Yuusuke C O Patent Divisi
Miyamura Masataka C O Patent D
Assignee
Tokyo Shibaura Electric Co
JP
IPC
H05K 03/34
G03C 01/68
B23K 35/22
H05K 03/28
G03F 07/032
B23K 35/22
C09D 11/10
H05K 03/28
G03F 07/032
B23K 35/22
C09D 11/10
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