0246467-A2 is referenced by 6 patents and cites 7 patents.

The inventive photosensitive resin composition has excellent heat resistance, adhesiveness to substrate surface and photosensitivity and suitable as a material for use as a solder resist or plating resist on printed circuit boards. The resin composition comprises, in addition to a photopolymerization initiator and curing agent for epoxy resins, a resinous ingredient composed of a diallyl phthalate resin, a first esterified resin as a reaction product of a cresol novolac type epoxy resin and 0.2-0.8 mole per mole of epoxy groups of an ethylenically unsaturated carboxylic acid and a second esterified resin as a reaction product of a phenol and/or cresol novolac type epoxy resins and 0.9-1.1 moles per mole of epoxy resins of an ethylenically unsaturated carboxylic acid in a limited proportion.

Title
Photosensitive resin composition and use thereof.
Application Number
EP19870106152 19870428
Publication Number
0246467 (A2)
Application Date
April 28, 1987
Publication Date
November 25, 1987
Inventor
Saito Akihiko
Tazawa Kenji
Assignee
Tokyo Ohka Kogyo
JP
IPC
H01K 03/00
C08L 63/10
C08G 59/17
C08F 299/02
H05K 03/28
H05K 03/18
G03F 07/038
G03F 07/032
C08L 63/00
C08L 31/00
C08G 59/00
C08F 299/00
H05K 03/28
H05K 03/18
G03F 07/038
G03F 07/032
C08L 63/10
C08L 31/08
C08G 59/40
C08G 59/16
C08G 59/08
C08G 59/00
C08F 299/02
C08G 59/18
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