0122687-A2 is referenced by 43 patents and cites 7 patents.

Title
A semiconductor device comprising packing means for protecting parts of the device.
Application Number
EP19840300521 19840127
Publication Number
0122687 (A2)
Application Date
January 27, 1984
Publication Date
October 24, 1984
Inventor
Takahama Takashi C O Mitsubish
Tamaki Akinobu C O Mitsubishi
Sakai Kunito C O Mitsubishi de
Assignee
Mitsubishi Electric
JP
IPC
H01L 23/08
H01L 23/04
H01L 23/28
H01L 23/16
H01L 23/12
H01L 23/02
H01L 21/02
H01L 23/31
H01L 23/29
H01L 23/26
H01L 23/20
H01L 23/14
H01L 23/08
H01L 23/057
H01L 23/02
H01L 21/56
H01L 23/06
View Original Source Download PDF