A photosensitive thermosetting resin composition, comrpising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powdered epoxy compound containing at least two epoxy groups in the molecular unit thereof and exhibiting sparing solubility in the diluent to be used, and optionally (E) a curing agent for epoxy resin, excels in developing property and sensitivity and enjoys a long shelf life. By subjecting this photosensitive thermosetting resin composition to coating, exposure, development, and post-curing, there can be formed a solder resist pattern which excels in adhesion,insulation resistance, resistance to electrolytic corrosion, resistance to soldering temperature, resistance to chemicals, and resistance to plating.

Title
Method for forming tin solder durable figures with photosensitive thermosetting resin composition
Application Number
93103607
Publication Number
1081557
Application Date
March 24, 1993
Publication Date
February 2, 1994
Inventor
Morio Suzuki
Kenji Sawazaki
Yuichi Kamayachi
Agent
WEI JINXI
Assignee
Taiyo Ink Manufacturing
IPC
H05K 03/00
C08L 63/04