A photosensitive thermosetting resin composition, comrpising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powdered epoxy compound containing at least two epoxy groups in the molecular unit thereof and exhibiting sparing solubility in the diluent to be used, and optionally (E) a curing agent for epoxy resin, excels in developing property and sensitivity and enjoys a long shelf life. By subjecting this photosensitive thermosetting resin composition to coating, exposure, development, and post-curing, there can be formed a solder resist pattern which excels in adhesion, insulation resistance, resistance to electrolytic corrosion, resistance to soldering temperature, resistance to chemicals, and resistance to plating.

Title
Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof
Application Number
88108283
Publication Number
1033389
Application Date
November 30, 1988
Publication Date
June 14, 1989
Inventor
Yuichi Kamayachi
Shoji Inagaki
Morio Suzuki
Kenji Sawazaki
Agent
HUANG JIAWEI
Assignee
Taiyo Ink Manufacturing
IPC
H05K 03/22
G03C 01/68
C08L 63/04
C08K 05/00