A method for testing grade of chip on LED includes sticking an adhesive tape at back said chip, cutting it to be multiple LED chip with adhesive tape, contacting P type and N type of electrodes on those chips by detection card with multiple detection structures in ohm mode, setting a light detector on each of said detection structure, setting these light detector correspondingly above those chips and using them to detect light source emitted by those Led chips.

Title
Crystal wafer testing method and structure of led
Application Number
200510114523
Publication Number
1956159
Application Date
October 24, 2005
Publication Date
May 2, 2007
Inventor
Li Yaorong
Zhao Yongqing
Wang Yonghe
Liu Anhong
Agent
shouning zhanghua hui
Assignee
Nanmao Science &Amp Technology
IPC
H01L 33/00
H01L 21/66